Work processes in the electronics industry
| Semiconductor wafer fabrication |
| Crystal purification and growth |
| Wafer preparation |
| Epitaxy and oxidation |
| Photolithography |
| Doping and type conversion |
| Metallisation, interconnections and packaging |
| Semiconductor assembly |
| Die separation |
| Die attach bonding |
| Wire bonding |
| Encapsulation |
| Housing and marking |
| Testing |
| Printed circuit board (PrCB) fabrication |
| Resin bonding |
| Impregnation |
| Laminating |
| Photomasking and etching |
| Cutting and drilling |
| Marking and testing |
| Printed circuit board (PrCB) assembly |
| Parts preparation |
| PrCB “stuffing” |
| Soldering, touch-up |
| Marking and testing |
| Final product assembly |
| Parts preparation |
| Parts assembly |
| Testing |
| Housing assembly |
| Marking and packaging |