Work section |
Wafer polishing | 3.02 | 1.78 to 5.13 | 2.49 | 1.44 to 4.32 |
Semiconductor assembly |
Front of line | – | – | – | – |
Middle of line | 1.19 | 0.79 to 1.80 | 0.95 | 0.61 to 1.47 |
End of line | 1.24 | 0.88 to 1.75 | 1.33 | 0.93 to 1.89 |
Parts assembly | 2.37 | 1.23 to 4.59 | 2.23 | 1.12 to 4.45 |
Chemical hazards |
Use chemicals in work process | 1.53 | 1.18 to 1.98 | 1.06 | 0.67 to 1.67 |
Smell chemicals (n=405) | 1.62 | 1.23 to 2.13 | 1.64 | 1.01 to 2.67 |
Exposed to/dissatisfied with conditions |
Temperature—too hot | 1.39 | 0.80 to 2.42 | – | – |
Temperature—too cold | 0.97 | 0.69 to 1.36 | – | – |
Noise | 1.17 | 0.89 to 1.54 | – | – |
Poor lighting | 1.85 | 0.73 to 4.68 | – | – |
Poor ventilation | 2.95 | 1.64 to 5.29 | 2.30 | 1.25 to 4.25 |