Work section |
Wafer polishing | 3.61 | 1.52 to 8.56 | 3.27 | 1.35 to 7.92 |
Semiconductor ssembly |
Front of line | 1.13 | 0.49 to 2.64 | 1.18 | 0.50 to 2.81 |
Middle of line | 1.23 | 0.53 to 2.86 | 1.07 | 0.45 to 2.54 |
End of line | 1.21 | 0.55 to 2.68 | 1.33 | 0.59 to 3.01 |
Parts assembly | – | – | – | – |
Chemical hazards |
Use chemicals in work process | 1.62 | 1.19 to 2.21 | 1.34 | 0.78 to 2.30 |
Smell chemicals (n=405) | 1.59 | 1.15 to 2.18 | 1.26 | 0.72 to 2.21 |
Exposed to/dissatisfied with conditions |
Temperature—too hot | 1.55 | 0.85 to 2.84 | – | – |
Temperature—too cold | 1.14 | 0.75 to 1.71 | – | – |
Noise | 1.29 | 0.93 to 1.79 | – | – |
Poor lighting | 3.10 | 1.27 to 7.58 | 1.74 | 0.63 to 4.80 |
Poor ventilation | 2.38 | 1.39 to 4.09 | 1.63 | 0.87 to 3.06 |