Semiconductor wafer fabrication
|
Crystal purification and growth |
Wafer preparation |
Epitaxy and oxidation |
Photolithography |
Doping and type conversion |
Metallisation, interconnections and packaging |
Semiconductor assembly
|
Die separation |
Die attach bonding |
Wire bonding |
Encapsulation |
Housing and marking |
Testing |
Printed circuit board (PrCB) fabrication
|
Resin bonding |
Impregnation |
Laminating |
Photomasking and etching |
Cutting and drilling |
Marking and testing |
Printed circuit board (PrCB) assembly
|
Parts preparation |
PrCB “stuffing” |
Soldering, touch-up |
Marking and testing |
Final product assembly
|
Parts preparation |
Parts assembly |
Testing |
Housing assembly |
Marking and packaging |