Work section |
Wafer polishing | 4.11 | 1.58 to 10.69 | 3.00 | 1.11 to 8.09 |
Semiconductor assembly |
Front of line | – | – | – | – |
Middle of line | 2.27 | 0.90 to 5.71 | 1.59 | 0.60 to 4.21 |
End of line | 2.08 | 0.91 to 4.77 | 2.02 | 0.86 to 4.72 |
Parts assembly | 1.10 | 0.22 to 5.47 | 1.06 | 0.21 to 5.36 |
Chemical hazards |
Use chemicals in work process | 1.61 | 1.00 to 2.61 | – | – |
Smell chemicals (n=405) | 1.68 | 1.03 to 2.74 | 1.50 | 0.86 to 2.61 |
Exposed to/dissatisfied with conditions |
Temperature—too hot | 1.90 | 0.83 to 4.37 | – | – |
Temperature—too cold | 1.70 | 0.96 to 3.01 | – | – |
Noise | 2.07 | 1.27 to 3.37 | 1.69 | 0.98 to 2.89 |
Poor lighting | 3.24 | 1.05 to 9.95 | 1.56 | 0.43 to 5.66 |
Poor ventilation | 3.05 | 1.51 to 6.16 | 1.73 | 0.74 to 4.03 |