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Occup Environ Med 60:262-270 doi:10.1136/oem.60.4.262
  • Original article

Relation between sick leave and selected exposure variables among women semiconductor workers in Malaysia

Table 8

Odds ratios of having taken sick leave in the past year for selected exposure variables (n=968)

Took sick leave within past year
Exposure variables Odds ratio 95% CI Adjusted odds ratio 95% CI
Adjusted odds ratios were obtained by logistic regression analysis with the covariates that were significantly related to the dependent variable. These were marital status, work section, work schedule, use chemicals in work process, smell chemicals, and poor ventilation.
Work section
    Wafer polishing 3.02 1.78 to 5.13 2.49 1.44 to 4.32
    Semiconductor assembly
        Front of line
        Middle of line 1.19 0.79 to 1.80 0.95 0.61 to 1.47
        End of line 1.24 0.88 to 1.75 1.33 0.93 to 1.89
    Parts assembly 2.37 1.23 to 4.59 2.23 1.12 to 4.45
Chemical hazards
    Use chemicals in work process 1.53 1.18 to 1.98 1.06 0.67 to 1.67
    Smell chemicals (n=405) 1.62 1.23 to 2.13 1.64 1.01 to 2.67
Exposed to/dissatisfied with conditions
    Temperature—too hot 1.39 0.80 to 2.42
    Temperature—too cold 0.97 0.69 to 1.36
    Noise 1.17 0.89 to 1.54
    Poor lighting 1.85 0.73 to 4.68
    Poor ventilation 2.95 1.64 to 5.29 2.30 1.25 to 4.25

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